For the soldered circuit board, it shall be inspected according to the PCBA appearance inspection standard, and the following phenomena are not allowed:

    (1) Poor contact angle of solder joints, solder leakage, and virtual soldering;

    (2) Short circuit caused by adhesion of solder legs, solder connection between two or more solder joints that should not be connected, or solder connection between solder joints and adjacent wires;

    (3) Device displacement refers to the lateral (horizontal), longitudinal (vertical), or rotational deviation of a component from a predetermined position within the plane of the solder pad (based on the centerline of the component and the centerline of the solder pad), and the position of the component or component pin is moved to the position of other pads or pins;

    (4) The polarity of the device is reversed, and the direction or polarity of the component with polarity does not comply with the requirements of the document (BOM, PCB component location diagram, etc.);

    (5) There is a gap or height between the components and the PCB, causing floating height;

    (6) Wrong parts, component specifications, models, parameters, shapes, etc. do not match (BOM, samples, customer information, etc.);   (7) Missing parts, according to the BOM or sample, those that should be mounted at the position of the device or on the PCB but have not been mounted are considered as missing parts;

    (8) Open circuit (broken circuit), PCB circuit disconnection phenomenon;

    (9) Reversing (flipping over) refers to the exchange of positions between two relatively symmetrical surfaces of components with differences (such as the surface with silk screen markings and the surface without silk screen markings reversed vertically). Chip resistors are common;

    (10) Tin beads; Small solder dots between component pins or outside of PA D;

    (11) Damaged  Components, board bottom, board surface, copper foil, circuits, through holes, etc. have cracks or cuts, damage, scratches on PCBs or buttons, and exposed copper foil;

    (12) Dirty and dirty; The board surface is unclean, with foreign objects or stains and other defects;

    (13) Gold finger impurities, abnormal spots such as pitting, tin spots, or solder mask on the surface of the gold finger coating, scratches on the gold finger, scratch marks or exposed copper platinum on the surface of the gold finger coating;