With the development of electronic devices towards simplicity and portability, the integration and miniaturization of electronic components are corresponding. The traditional buried hole installation technology (THT) can no longer meet the requirements, and a new generation of surface mount technology (SMT) has emerged in response.
From a theoretical perspective, SMT includes Surface Mount Components (SMC), Surface Mount Devices (SMD), Surface Mount Printed Circuit Boards (SMB), Printed Circuit Boards (PCB), and a complete production process such as gluing, pasting, surface mount equipment, component placement systems, soldering, and online testing.

  Because SMC and SMD reduce the influence of wire characteristics and are firmly soldered on the PCB surface, the parasitic capacitance and parasitic inductance of parasitic capacitance are greatly reduced. Interference signals and radio frequency interference are greatly reduced, and high-frequency characteristics are improved. This component has been widely used in satellite communication products: for example, low-noise down conversion amplifiers are used when receiving satellite signals on the road (LNB). Other high-frequency products, in addition to PCBs, have characteristic parameters such as dielectric constant X. For example, 1099HZ usually requires a time of X

  The surface bonding process mainly includes three basic stages: coating solder paste, mounting and soldering. Below are the first two basic stages.
In mass production, we usually use automatic printing machines for printing (i.e. applying solder paste). Before entering the printing machine to apply solder paste, the PCB should be fixed in the printing machine and the printing machine should be fixed in the printing machine. There are usually two methods for fixing PCBs in the printing machine: one is to transfer the slide rail and position them, and the other is to choose vacuum suction fixing and positioning under the transfer slide rail.